Groundbreaking for Phase 1 of Honam Semiconductor Complex (630,000 Pyeong) Set for Next Year

Groundbreaking for Phase 1 of Honam Semiconductor Complex (630,000 Pyeong) Next Year... Embankment Plans Take Shape
As the first step in the 800 trillion won Honam Semiconductor Cluster development project, plans are being finalized for the supply of soil required for embankment work to prepare the sites for two fabrication plants (fabs) scheduled to break ground next year.
The plan involves prioritizing the use of soil from large-scale apartment construction sites at the former Imdong textile mill and private park special development projects, while filling any shortages by sourcing soil from quarries in adjacent cities and counties.
According to the Jeonnam Gwangju Integrated Special City on the 14th, the Korea Land and Housing Corporation (LH), the project implementer for the Honam Advanced Semiconductor National Industrial Complex, will begin foundation work for the Phase 1 construction of two fabs early next year on 630,000 pyeong (2.08 million ㎡) of priority development land within the Gwangju Military Airport area, which is the candidate site for the industrial complex.